ZOT Printed Circuit Boards

ZOT Printed Circuit Boards

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Products

Our factory is equipped with only the most advanced technology to offer you a superior product for a diverse range of applications including Rigid, Multilayer, HDI, Flexi-rigid and High Frequency products . We specialize in High technology quick turnaround / prototype to mid volume PCB manufacturing at our UK facility and high volume through our Global Procurement Division

Our vast experience and knowledge in PCB Fabrication has covered work for almost all industry sectors, including the following:

  • Military
  • Aerospace
  • Security
  • Space
  • Medical
  • Commercial
  • Industrial
  • Broadcasting

Our factory is equipped with only the most advanced technology to offer you a superior product for a diverse range of applications including Rigid, Multilayer, HDI, Flexi-rigid and High Frequency products . We specialize in High technology quick turnaround / prototype to mid volume PCB manufacturing at our UK facility and high volume through our Global Procurement Division

Rigid / Multilayer

We can offers a full range of rigid board constructions from single / double sided up to 32 layers and beyond, with vast experience in high layer count / high technology boards.

We have continually invested not only in the equipment and processes to allow the production of these high technology boards, but also in the latest test and inspection equipment to ensure the highest quality.

Some key rigid technology features are:

  • High layer count multilayer
  • FR4 / Polyimide / High Speed / Special Materials
  • Micro via / Blind via / Buried via
  • Stacked vias
  • Controlled Impedance

Flex-Rigid

We offer a full range of flex / flexi rigid products:

  • Double sided flex
  • Multilayer flex
  • Multilayer flexi rigid

Depending on design these can incorporate other technologies such as:

  • Micro via
  • Sequential build up
  • Internal / External heatsinks
  • High speed requirements

HDI – Sequential Build up boards

With the increasing component densities demanded by today's technology, sequential build-ups are often the only viable solution for the PCB construction.

We have years of experience in producing these types of construction, incorporating buried, blind and micro vias in a range of combinations.

Some key features of our  HDI technology  are:

  • Standard micro via
  • Copper filled micro via
  • Stacked micro via (3 layers +)
  • Resin filled buried and through vias
  • Resin filled and copper capped buried and through vias

Latest news

ESI 5335 Laser Drill / Rout 21/10/19

We are pleased to announce the completed installation of the ESI 5335 Laser Dill and Rout MAchine. This provides Zot with…
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New Cupric Etch & Strip Line 04/09/19

Zot is happy to announce that they have placed an order for a new Cupric Etch and Resist Strip Line from UCE - supplied a…
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